Reliability and Failure of Solid State Devices (EE/MT/PEP595)

Explore the electrical, chemical, environmental, and mechanical driving forces that compromise the integrity and lead to the failure of devices. Model and statistically quantify both chip and packaging level failures. Become familiar with packaging level thermal stresses, solder creep, fatigue and fracture, contact relaxation, corrosion and environmental degradation. Learn about strategies to enhance reliability, the roles of defects, yield modeling, testing, and failure mode analysis.